ASCENTECH Displays New Features on Solderability, Paste Analyzer Systems at IPC Midwest

Ascentech LLC will exhibit and highlight recently-introduced improvements and features to the GEN3 Systems, Ltd. MUST III Solderability Test equipment, and SPC1000 Solder Paste Analyzer at IPC Midwest this fall, in the GEN3-Ascentech booth.
The MUST III is a wetting balance testing system capable of testing to all relevant solder standards
including ICE, MIL-STD, IPO/EYE/JADE, etc. The MUST System 3 measures the solderability of a printed circuit board and/or component's metallic terminations by documenting the wetting curve of the unit under test. The MUST System 3 is appropriate for testing all devices including multi-leaded components as well as SMT and BGA devices.
The SPA 1000 Solder Paste Analyzer is a unique 6-in-1 solder paste test system that can perform up to six separate tests, for "Slump, Solder Ball, Tack, Wetting, Spread", that would previously have been performed by separate instruments, in accordance to IEC 61189-5 and IPC-TM-650 standards. The SPA 1000 is a unique "All-in-One" test system that can also be used to conduct solder paste "Open Time" testing. ASCENTECH Displays New Features on Solderability, Paste Analyzer Systems at IPC Midwest
Ascentech LLC will exhibit and highlight recently-introduced improvements and features to the GEN3 Systems, Ltd. MUST III Solderability Test equipment, and SPC1000 Solder Paste Analyzer at IPC Midwest this fall, in the GEN3-Ascentech booth.
The MUST III is a wetting balance testing system capable of testing to all relevant solder standards
including ICE, MIL-STD, IPO/EYE/JADE, etc. The MUST System 3 measures the solderability of a printed circuit board and/or component's metallic terminations by documenting the wetting curve of the unit under test. The MUST System 3 is appropriate for testing all devices including multi-leaded components as well as SMT and BGA devices.
The SPA 1000 Solder Paste Analyzer is a unique 6-in-1 solder paste test system that can perform up to six separate tests, for "Slump, Solder Ball, Tack, Wetting, Spread", that would previously have been performed by separate instruments, in accordance to IEC 61189-5 and IPC-TM-650 standards. The SPA 1000 is a unique "All-in-One" test system that can also be used to conduct solder paste "Open Time" testing.
ASCENTECH Displays New Features on Solderability, Paste Analyzer Systems at IPC Midwest
Ascentech LLC will exhibit and highlight recently-introduced improvements and features to the GEN3 Systems, Ltd. MUST III Solderability Test equipment, and SPC1000 Solder Paste Analyzer at IPC Midwest this fall, in the GEN3-Ascentech booth.
The MUST III is a wetting balance testing system capable of testing to all relevant solder standards
including ICE, MIL-STD, IPO/EYE/JADE, etc. The MUST System 3 measures the solderability of a printed circuit board and/or component's metallic terminations by documenting the wetting curve of the unit under test. The MUST System 3 is appropriate for testing all devices including multi-leaded components as well as SMT and BGA devices.
The SPA 1000 Solder Paste Analyzer is a unique 6-in-1 solder paste test system that can perform up to six separate tests, for "Slump, Solder Ball, Tack, Wetting, Spread", that would previously have been performed by separate instruments, in accordance to IEC 61189-5 and IPC-TM-650 standards. The SPA 1000 is a unique "All-in-One" test system that can also be used to conduct solder paste "Open Time" testing.
ASCENTECH Displays New Features on Solderability, Paste Analyzer Systems at IPC Midwest
Ascentech LLC will exhibit and highlight recently-introduced improvements and features to the GEN3 Systems, Ltd. MUST III Solderability Test equipment, and SPC1000 Solder Paste Analyzer at IPC Midwest this fall, in the GEN3-Ascentech booth.
The MUST III is a wetting balance testing system capable of testing to all relevant solder standards
including ICE, MIL-STD, IPO/EYE/JADE, etc. The MUST System 3 measures the solderability of a printed circuit board and/or component's metallic terminations by documenting the wetting curve of the unit under test. The MUST System 3 is appropriate for testing all devices including multi-leaded components as well as SMT and BGA devices.
The SPA 1000 Solder Paste Analyzer is a unique 6-in-1 solder paste test system that can perform up to six separate tests, for "Slump, Solder Ball, Tack, Wetting, Spread", that would previously have been performed by separate instruments, in accordance to IEC 61189-5 and IPC-TM-650 standards. The SPA 1000 is a unique "All-in-One" test system that can also be used to conduct solder paste "Open Time" testing.
ASCENTECH Displays New Features on Solderability, Paste Analyzer Systems at IPC Midwest
Ascentech LLC will exhibit and highlight recently-introduced improvements and features to the GEN3 Systems, Ltd. MUST III Solderability Test equipment, and SPC1000 Solder Paste Analyzer at IPC Midwest this fall, in the GEN3-Ascentech booth.
The MUST III is a wetting balance testing system capable of testing to all relevant solder standards
including ICE, MIL-STD, IPO/EYE/JADE, etc. The MUST System 3 measures the solderability of a printed circuit board and/or component's metallic terminations by documenting the wetting curve of the unit under test. The MUST System 3 is appropriate for testing all devices including multi-leaded components as well as SMT and BGA devices.
The SPA 1000 Solder Paste Analyzer is a unique 6-in-1 solder paste test system that can perform up to six separate tests, for "Slump, Solder Ball, Tack, Wetting, Spread", that would previously have been performed by separate instruments, in accordance to IEC 61189-5 and IPC-TM-650 standards. The SPA 1000 is a unique "All-in-One" test system that can also be used to conduct solder paste "Open Time" testing.
ASCENTECH Displays New Features on Solderability, Paste Analyzer Systems at IPC Midwest
Ascentech LLC will exhibit and highlight recently-introduced improvements and features to the GEN3 Systems, Ltd. MUST III Solderability Test equipment, and SPC1000 Solder Paste Analyzer at IPC Midwest this fall, in the GEN3-Ascentech booth.
The MUST III is a wetting balance testing system capable of testing to all relevant solder standards
including ICE, MIL-STD, IPO/EYE/JADE, etc. The MUST System 3 measures the solderability of a printed circuit board and/or component's metallic terminations by documenting the wetting curve of the unit under test. The MUST System 3 is appropriate for testing all devices including multi-leaded components as well as SMT and BGA devices.
The SPA 1000 Solder Paste Analyzer is a unique 6-in-1 solder paste test system that can perform up to six separate tests, for "Slump, Solder Ball, Tack, Wetting, Spread", that would previously have been performed by separate instruments, in accordance to IEC 61189-5 and IPC-TM-650 standards. The SPA 1000 is a unique "All-in-One" test system that can also be used to conduct solder paste "Open Time" testing.